Heat Spreader Thermal Switch for Power Converter Isothermalization

Power module heat dissipation with spatial inhomogeneity and induced nonuniform temperature distribution presents a challenging concern for system reliability due to thermo-mechanical stresses. These challenges are especially important nonplanar designs using 3-D packaging principles. Here, we develop spreader thermal switch capable of actively reducing gradients between silicon carbide (SiC) devices in three-level T-type power converter, which can change depending on electronic operating conditions. The consists stainless-steel (SS) copper sliding embedded within the spreader. Heat transfer from SiC be controlled by moving slider positions To understand mechanisms design switch, conducted finite element method simulations calculate minimum attainable difference devices. We used simulation quantify reduction junction swing during dynamic operation coupled results Coffin–Manson model lifetime failure. integrated one phase three-phase converter demonstrated isothermalization at different working At 2.4-kW power, each hot device dissipated 4.7 W heat, resulting case 43 °C, cold dissipating 1.7 38 °C. device-to-device was decreased 5 °C 0 distance 20 mm. Finite volume (FVM) conjugate problem validate experimental support analysis key performance parameters. This work demonstrates successful an active develops guidelines electro-thermal codesign implementation switches other electronics applications enhanced is issue.